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오르벡의 오포 파인드X 전면 3D 뎁스 감지 시스템
Orbbec’s Front 3D Depth Sensing System in the Oppo Find X
◇발행처: SPC    ◇발행일: 2018년 11월   ◇가격: €3,990[PDF]    ◇페이지수: 쪽   
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Introduction

Company Profile

Oppo Find X – Teardown

Market Analysis

Physical Analysis

> Physical Analysis Methodology

> NIR Camera Module Disassembly and Cross-Section

> Sensor Die

- View, dimensions, pixels, pads, markings, die process and cross-section

> DOT Projector Module Disassembly and Cross-Section

> NIR VCSEL Die

- View, dimensions, die process and cross-section

> Orbbec MX6300B – Component Analysis

- Package/die view and dimensions

- Die delayering, main block IDs and structural blocks

- Die process and cross-section

> Physical Data Summary

Physical Comparison: Apple iPhone X

> System Integration

> NIR Camera Module and Sensor

> Dot Projector Module and VCSEL

Manufacturing Process Flow

> Die Fabrication Unit : NIR Image Sensor, NIR VCSEL, Orbbec SoC

> NIR VCSEL Process Flow

Cost Analysis

> Cost Analysis Overview

> Supply Chain Description and Yield Hypotheses

> NIR Image Camera Module Cost

- Front-end (FE), microlens and total FE cost

- Wafer and die cost

- Lens module and assembly cost

> NIR VCSEL Die Cost

- Front-end (FE), wafer and die cost

- Front-end cost per process steps

- Lens module and assembly cost

> SoC Die Cost

- Front-end (FE), wafer and die cost

- Packaging and component cost

Estimated Price Analysis: NIR Camera Module, DOT Projector Module, SoC and Optical Hub

Title: Orbbec’s Front 3D Depth Sensing System in the Oppo Find X
 
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